Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9841279 | Apparatus and method for quantitative evaluation of braze bonding length with use of radiation | Ryosuke Ohirabaru, Makoto Takanezawa, Kazuya Segawa, Hideyuki Nakamura, Shigeru Harada +3 more | 2017-12-12 |
| 9625273 | Thickness measurement apparatus and method thereof | Hidehiko Kuroda, Yoshihiro Yamashita | 2017-04-18 |