Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9730332 | Surface treated copper foil and laminate using the same, printed wiring board, and copper clad laminate | Hideta Arai, Atsushi Miki, Kaichiro Nakamuro | 2017-08-08 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9730332 | Surface treated copper foil and laminate using the same, printed wiring board, and copper clad laminate | Hideta Arai, Atsushi Miki, Kaichiro Nakamuro | 2017-08-08 |