Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9724896 | Copper heat dissipation material, carrier-attached copper foil, connector, terminal, laminate, shield material, printed-wiring board, metal processed member, electronic device and method for manufacturing the printed wiring board | Hajime Momoi, Satoru Morioka, Toshiyuki Ono, Ryo Fukuchi, Atsushi Miki | 2017-08-08 |
| 9730332 | Surface treated copper foil and laminate using the same, printed wiring board, and copper clad laminate | Atsushi Miki, Kohsuke Arai, Kaichiro Nakamuro | 2017-08-08 |
| 9580829 | Copper foil for printed circuit | Atsushi Miki | 2017-02-28 |