Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9543201 | Method for forming three-dimensional interconnection, circuit arrangement comprising three-dimensional interconnection, and metal film-forming composition for three-dimensional interconnection | Kenzou Ookita, Isao Aritome, Keisuke Kuriyama, Kazuto Watanabe, Atsushi Kobayashi +1 more | 2017-01-10 |