Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9746775 | Method for manufacturing substrate having concave pattern, composition, method for forming conductive film, electronic circuit and electronic device | Hitoshi Hamaguchi, Kenrou Tanaka, Kenzou Ookita | 2017-08-29 |
| 9543201 | Method for forming three-dimensional interconnection, circuit arrangement comprising three-dimensional interconnection, and metal film-forming composition for three-dimensional interconnection | Kenzou Ookita, Isao Aritome, Taichi Matsumoto, Kazuto Watanabe, Atsushi Kobayashi +1 more | 2017-01-10 |