Issued Patents 2017
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9831219 | Manufacturing method of package structure | Kuo-Ting Lin, Li-Chih Fang, Chia-Jen Chou | 2017-11-28 |
| 9761568 | Thin fan-out multi-chip stacked packages and the method for manufacturing the same | Li-Chih Fang, Chia-Wei Chang, Kuo-Ting Lin | 2017-09-12 |
| 9716080 | Thin fan-out multi-chip stacked package structure and manufacturing method thereof | Chia-Wei Chang | 2017-07-25 |
| 9673178 | Method of forming package structure with dummy pads for bonding | Chia-Hsiang Yuan, Chia-Wei Chang, Kuo-Ting Lin | 2017-06-06 |
| 9659911 | Package structure and manufacturing method thereof | Chia-Wei Chang, Li-Chih Fang, Kuo-Ting Lin | 2017-05-23 |