| 9773741 |
Bondable device including a hydrophilic layer |
Shiqun Gu, William Xia |
2017-09-26 |
| 9754923 |
Power gate placement techniques in three-dimensional (3D) integrated circuits (ICs) (3DICs) |
Jing Xie, Kambiz Samadi, Pratyush Kamal, Javid Jaffari |
2017-09-05 |
| 9741691 |
Power delivery network (PDN) design for monolithic three-dimensional (3-D) integrated circuit (IC) |
Sung Kyu Lim, Kambiz Samadi |
2017-08-22 |
| 9712168 |
Process variation power control in three-dimensional (3D) integrated circuits (ICs) (3DICs) |
Giby Samson, Yu Pu |
2017-07-18 |
| 9626311 |
Memory controller placement in a three-dimensional (3D) integrated circuit (IC) (3DIC) employing distributed through-silicon-via (TSV) farms |
Sung Kyu Lim, Karamvir CHATHA, Kambiz Samadi |
2017-04-18 |
| 9628077 |
Dual power swing pipeline design with separation of combinational and sequential logics |
Jing Xie |
2017-04-18 |
| 9583473 |
Complete system-on-chip (SOC) using monolithic three dimensional (3D) integrated circuit (IC) (3DIC) technology |
— |
2017-02-28 |
| 9583179 |
Three-dimensional (3D) memory cell separation among 3D integrated circuit (IC) tiers, and related 3D integrated circuits (3DICs), 3DIC processor cores, and methods |
Jing Xie |
2017-02-28 |
| 9578762 |
Television monitor combination stand and wall mount |
Timothy M. Cassidy, He Kaizuan |
2017-02-21 |
| 9543383 |
High-speed high-power semiconductor devices |
Vladimir Aparin, Robert P. Gilmore |
2017-01-10 |
| 9536840 |
Three-dimensional (3-D) integrated circuits (3DICS) with graphene shield, and related components and methods |
— |
2017-01-03 |