Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9711484 | Semiconductor package with semiconductor die directly attached to lead frame and method | Jong Sik Paek, Doo Hyun Park, Yong Seon Song, Sung Geun Kang | 2017-07-18 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9711484 | Semiconductor package with semiconductor die directly attached to lead frame and method | Jong Sik Paek, Doo Hyun Park, Yong Seon Song, Sung Geun Kang | 2017-07-18 |