Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9711484 | Semiconductor package with semiconductor die directly attached to lead frame and method | Jong Sik Paek, Doo Hyun Park, Wang Gu Lee, Sung Geun Kang | 2017-07-18 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9711484 | Semiconductor package with semiconductor die directly attached to lead frame and method | Jong Sik Paek, Doo Hyun Park, Wang Gu Lee, Sung Geun Kang | 2017-07-18 |