Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9748177 | Embedded structures for package-on-package architecture | Weng Hong Teh | 2017-08-29 |
| 9633837 | Methods of providing dielectric to conductor adhesion in package structures | Ebrahim Andideh | 2017-04-25 |