TS

Tuhin Sinha

IBM: 1 patents #5,570 of 10,852Top 55%
📍 Oradell, NJ: #6 of 11 inventorsTop 55%
🗺 New Jersey: #2,569 of 7,092 inventorsTop 40%
Overall (2017): #208,481 of 506,227Top 45%
1
Patents 2017

Issued Patents 2017

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
9818655 Method and structure for flip-chip package reliability monitoring using capacitive sensors groups Taryn J. Davis, Jonathan Fry 2017-11-14