TD

Taryn J. Davis

IBM: 1 patents #5,570 of 10,852Top 55%
📍 Beacon, NY: #14 of 34 inventorsTop 45%
🗺 New York: #4,556 of 12,278 inventorsTop 40%
Overall (2017): #227,189 of 506,227Top 45%
1
Patents 2017

Issued Patents 2017

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
9818655 Method and structure for flip-chip package reliability monitoring using capacitive sensors groups Jonathan Fry, Tuhin Sinha 2017-11-14