Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9814166 | Method of manufacturing electronic package module | Jen-Chun Chen, Chia-Cheng Liu | 2017-11-07 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9814166 | Method of manufacturing electronic package module | Jen-Chun Chen, Chia-Cheng Liu | 2017-11-07 |