Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9814166 | Method of manufacturing electronic package module | Jen-Chun Chen, TSUNG-JUNG CHENG | 2017-11-07 |
| 9681545 | Substrate structure and display panel using same | Chia-Hsiung Chang, An-Chang WANG, Chao-Hsiang Wang, Yang-Chen Chen | 2017-06-13 |