Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9741691 | Power delivery network (PDN) design for monolithic three-dimensional (3-D) integrated circuit (IC) | Kambiz Samadi, Yang Du | 2017-08-22 |
| 9626311 | Memory controller placement in a three-dimensional (3D) integrated circuit (IC) (3DIC) employing distributed through-silicon-via (TSV) farms | Karamvir CHATHA, Yang Du, Kambiz Samadi | 2017-04-18 |