Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9842838 | Structure and method of latchup robustness with placement of through wafer via within CMOS circuitry | Phillip F. Chapman, David S. Collins | 2017-12-12 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9842838 | Structure and method of latchup robustness with placement of through wafer via within CMOS circuitry | Phillip F. Chapman, David S. Collins | 2017-12-12 |