Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9842838 | Structure and method of latchup robustness with placement of through wafer via within CMOS circuitry | Phillip F. Chapman, Steven H. Voldman | 2017-12-12 |
DC
David S. Collins
Overall (2017): #451,854 of 506,227Top 90%
1
Patents 2017