SH

Seiji Harada

DI Disco: 3 patents #12 of 89Top 15%
Overall (2017): #60,594 of 506,227Top 15%
3
Patents 2017

Issued Patents 2017

Patent #TitleCo-InventorsDate
9786490 Wafer processing method and electronic device 2017-10-10
9679820 Evaluation method of device wafer Naoya Sukegawa 2017-06-13
9543189 Laminated wafer processing method Satoshi Kobayashi, Yasuyoshi Yubira 2017-01-10