Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9649723 | Processing apparatus including laser beam applying mechanism and separating means | Yoshio Umeda, Satoshi Kobayashi | 2017-05-16 |
| 9543189 | Laminated wafer processing method | Seiji Harada, Satoshi Kobayashi | 2017-01-10 |