Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9852976 | Semiconductor package and fabricating method thereof | Michael Kelly, David Jon Hiner, Ronald Patrick Huemoeller | 2017-12-26 |
| 9721872 | Methods and structures for increasing the allowable die size in TMV packages | Louis W. Nicholls, Jin Seong Kim, Woon Kab Jung, Sung Jin Yang, Robert Francis Darveaux | 2017-08-01 |
| 9543242 | Semiconductor package and fabricating method thereof | Michael Kelly, David Jon Hiner, Ronald Patrick Huemoeller | 2017-01-10 |