Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9721872 | Methods and structures for increasing the allowable die size in TMV packages | Roger D. St. Amand, Jin Seong Kim, Woon Kab Jung, Sung Jin Yang, Robert Francis Darveaux | 2017-08-01 |