Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9754852 | Packaging for fingerprint sensors and methods of manufacture | Ronald Patrick Huemoeller, David Bolognia, Brett Dunlap | 2017-09-05 |
| 9721872 | Methods and structures for increasing the allowable die size in TMV packages | Louis W. Nicholls, Roger D. St. Amand, Jin Seong Kim, Woon Kab Jung, Sung Jin Yang | 2017-08-01 |