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OMin Kwon

SC Stats Chippac: 1 patents #50 of 128Top 40%
Overall (2017): #289,205 of 506,227Top 60%
1
Patents 2017

Issued Patents 2017

Patent #TitleCo-InventorsDate
9673171 Integrated circuit packaging system with coreless substrate and method of manufacture thereof HeeJo Chi, HeeSoo Lee 2017-06-06