Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9812362 | Wafer processing method | Hiroshi Morikazu | 2017-11-07 |
| 9793166 | Lift-off method | Tasuku Koyanagi, Hiroshi Morikazu | 2017-10-17 |
| 9761492 | Processing method of optical device wafer | Takumi Shotokuji, Naotoshi Kirihara | 2017-09-12 |
| 9735040 | Method of processing single-crystal substrate | Hiroshi Morikazu, Takumi Shotokuji | 2017-08-15 |
| 9682440 | Chip manufacturing method | Hiroshi Morikazu | 2017-06-20 |
| 9537046 | Optical device wafer processing method | Hiroshi Morikazu | 2017-01-03 |