| 9831128 |
Method of processing a substrate |
Karl Heinz Priewasser, Nao Hattori |
2017-11-28 |
| 9812362 |
Wafer processing method |
Noboru Takeda |
2017-11-07 |
| 9793166 |
Lift-off method |
Tasuku Koyanagi, Noboru Takeda |
2017-10-17 |
| 9735040 |
Method of processing single-crystal substrate |
Noboru Takeda, Takumi Shotokuji |
2017-08-15 |
| 9721809 |
Method of forming gettering layer |
Nao Hattori |
2017-08-01 |
| 9682440 |
Chip manufacturing method |
Noboru Takeda |
2017-06-20 |
| 9656347 |
Laser processing method for forming a laser processed hole in a work piece |
— |
2017-05-23 |
| 9613795 |
Wafer processing method to remove crystal strains |
Kenya Kai |
2017-04-04 |
| 9576835 |
Workpiece processing method |
Frank Wei, Nao Hattori |
2017-02-21 |
| 9543466 |
Method for forming shield tunnels in single-crystal substrates |
— |
2017-01-10 |
| 9536786 |
Wafer processing method using pulsed laser beam to form shield tunnels along division lines of a semiconductor wafer |
Motohiko Shimada |
2017-01-03 |
| 9537046 |
Optical device wafer processing method |
Noboru Takeda |
2017-01-03 |