Issued Patents 2017
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9852976 | Semiconductor package and fabricating method thereof | David Jon Hiner, Ronald Patrick Huemoeller, Roger D. St. Amand | 2017-12-26 |
| 9836616 | Creating distinct user spaces through user identifiers | Philip Schentrup, Eoin Hyden | 2017-12-05 |
| 9818684 | Electronic device with a plurality of redistribution structures having different respective sizes | David Jon Hiner, Ronald Patrick Huemoeller, Young Rae Kim, JiYoung Chung, Minho Chang +1 more | 2017-11-14 |
| 9799592 | Semicondutor device with through-silicon via-less deep wells | Ronald Patrick Huemoeller, David Jon Hiner | 2017-10-24 |
| 9704842 | Interposer, manufacturing method thereof, semiconductor package using the same, and method for fabricating the semiconductor package | Donghoon Lee, Dohyung Kim, Jungsoo Park, Seungchul Han, Joohyun Kim +2 more | 2017-07-11 |
| 9653428 | Semiconductor package and fabricating method thereof | David Jon Hiner, Ronald Patrick Huemoeller | 2017-05-16 |
| 9627353 | Method of manufacturing a semiconductor package | David Jon Hiner, Ji Hun Lee, Won Chul Do, Doo Hyun Park, Ronald Patrick Huemoeller | 2017-04-18 |
| 9553041 | Semiconductor device package and manufacturing method thereof | Ronald Patrick Huemoeller, Won Chul Do, David Jon Hiner | 2017-01-24 |
| 9543242 | Semiconductor package and fabricating method thereof | David Jon Hiner, Ronald Patrick Huemoeller, Roger D. St. Amand | 2017-01-10 |