Issued Patents 2017
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9837328 | Semiconductor device packages | — | 2017-12-05 |
| 9837327 | Methods for forming semiconductor device packages | — | 2017-12-05 |
| 9824995 | Flexible circuit leads in packaging for radio frequency devices | Michael E. Watts | 2017-11-21 |
| 9799580 | Semiconductor device package and methods of manufacture thereof | Li Li, Jaynal A. Molla | 2017-10-24 |
| 9800208 | Radio frequency devices with surface-mountable capacitors for decoupling and methods thereof | Mahesh K. Shah, Jerry L. White, Li Li, Hussain H. Ladhani, Audel A. Sanchez +1 more | 2017-10-24 |
| 9748185 | Semiconductor devices with impedance matching-circuits | Jeffrey K. Jones, Scott D. Marshall | 2017-08-29 |
| 9698116 | Thick-silver layer interface for a semiconductor die and corresponding thermal layer | Jaynal A. Molla | 2017-07-04 |
| 9673162 | High power semiconductor package subsystems | Scott M. Hayes, Scott D. Marshall, Mahesh K. Shah | 2017-06-06 |
| 9614046 | Semiconductor devices with a thermally conductive layer | Bruce M. Green, Darrell G. Hill, L. M. Mahalingam | 2017-04-04 |
| 9589860 | Electronic devices with semiconductor die coupled to a thermally conductive substrate | Jaynal A. Molla | 2017-03-07 |
| 9538659 | Solder wettable flanges and devices and systems incorporating solder wettable flanges | Jaynal A. Molla, Mahesh K. Shah | 2017-01-03 |