Issued Patents 2017
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9837384 | Fan-out multi-chip package with plurality of chips stacked in staggered stack arrangement | Chia-Wei Chang | 2017-12-05 |
| 9831219 | Manufacturing method of package structure | Yong-Cheng Chuang, Li-Chih Fang, Chia-Jen Chou | 2017-11-28 |
| 9761568 | Thin fan-out multi-chip stacked packages and the method for manufacturing the same | Li-Chih Fang, Chia-Wei Chang, Yong-Cheng Chuang | 2017-09-12 |
| 9716079 | Multi-chip package having encapsulation body to replace substrate core | Chia-Wei Chang | 2017-07-25 |
| 9673178 | Method of forming package structure with dummy pads for bonding | Chia-Hsiang Yuan, Chia-Wei Chang, Yong-Cheng Chuang | 2017-06-06 |
| 9659911 | Package structure and manufacturing method thereof | Chia-Wei Chang, Li-Chih Fang, Yong-Cheng Chuang | 2017-05-23 |