Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9658255 | Signal monitoring of through-wafer vias using a multi-layer inductor | Mark A. DiRocco, Kirk D. Peterson, Norman W. Robson | 2017-05-23 |
KS
Keith C. Stevens
Overall (2017): #346,809 of 506,227Top 70%
1
Patents 2017