Issued Patents 2017
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9754923 | Power gate placement techniques in three-dimensional (3D) integrated circuits (ICs) (3DICs) | Jing Xie, Pratyush Kamal, Yang Du, Javid Jaffari | 2017-09-05 |
| 9741691 | Power delivery network (PDN) design for monolithic three-dimensional (3-D) integrated circuit (IC) | Sung Kyu Lim, Yang Du | 2017-08-22 |
| 9626311 | Memory controller placement in a three-dimensional (3D) integrated circuit (IC) (3DIC) employing distributed through-silicon-via (TSV) farms | Sung Kyu Lim, Karamvir CHATHA, Yang Du | 2017-04-18 |
| 9629233 | Techniques for implementing a synthetic jet to cool a device | Mehdi Saeidi, Arpit Mittal, Emil Rahim, Rajat Mittal | 2017-04-18 |