Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9626311 | Memory controller placement in a three-dimensional (3D) integrated circuit (IC) (3DIC) employing distributed through-silicon-via (TSV) farms | Sung Kyu Lim, Yang Du, Kambiz Samadi | 2017-04-18 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9626311 | Memory controller placement in a three-dimensional (3D) integrated circuit (IC) (3DIC) employing distributed through-silicon-via (TSV) farms | Sung Kyu Lim, Yang Du, Kambiz Samadi | 2017-04-18 |