Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9704748 | Method of dicing a wafer | Michael Roesner, Gudrun Stranzl, Rudolf Rothmaler | 2017-07-11 |
JO
Joerg Ortner
Overall (2017): #365,239 of 506,227Top 75%
1
Patents 2017