Issued Patents 2017
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9699918 | Package assembly and method for manufacturing the same | Xiaochun Tan | 2017-07-04 |
| 9677133 | Biological chip hybridization system | Pinhong Wang, Guoqing Wang, Liqing Duan, Kaijun Zhao, Jinxiu Zhang +4 more | 2017-06-13 |
| 9671317 | Automatic injection device for microarray chip and automatic injection hybridization microarray chip | Pinhong Wang, Guoqing Wang, Wanli Xing | 2017-06-06 |
| 9595453 | Chip package method and package assembly | Xiaochun Tan | 2017-03-14 |
| 9559043 | Multi-level leadframe with interconnect areas for soldering conductive bumps, multi-level package assembly and method for manufacturing the same | — | 2017-01-31 |