Issued Patents 2017
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9786521 | Chip package method for reducing chip leakage current | — | 2017-10-10 |
| 9780081 | Chip package structure and manufacturing method therefor | — | 2017-10-03 |
| 9735122 | Flip chip package structure and fabrication process thereof | — | 2017-08-15 |
| 9699918 | Package assembly and method for manufacturing the same | Jiaming Ye | 2017-07-04 |
| 9653355 | Flip chip package structure and fabrication process thereof | — | 2017-05-16 |
| 9595453 | Chip package method and package assembly | Jiaming Ye | 2017-03-14 |