Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9754923 | Power gate placement techniques in three-dimensional (3D) integrated circuits (ICs) (3DICs) | Kambiz Samadi, Pratyush Kamal, Yang Du, Javid Jaffari | 2017-09-05 |
| 9628077 | Dual power swing pipeline design with separation of combinational and sequential logics | Yang Du | 2017-04-18 |
| 9583179 | Three-dimensional (3D) memory cell separation among 3D integrated circuit (IC) tiers, and related 3D integrated circuits (3DICs), 3DIC processor cores, and methods | Yang Du | 2017-02-28 |