Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9741701 | Method of manufacturing a package-on-package type semiconductor package | Dong Jin Kim, Jin Han Kim, Se Woong Cha, Joon Dong Kim, Yeong Beom Ko | 2017-08-22 |
| 9627353 | Method of manufacturing a semiconductor package | Michael Kelly, David Jon Hiner, Won Chul Do, Doo Hyun Park, Ronald Patrick Huemoeller | 2017-04-18 |
| 9536858 | Semiconductor device and manufacturing method thereof | Won Chul Do, Doo Hyun Park, Jong Sik Paek, Seong Min Seo | 2017-01-03 |