Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9741701 | Method of manufacturing a package-on-package type semiconductor package | Dong Jin Kim, Jin Han Kim, Se Woong Cha, Ji Hun Lee, Yeong Beom Ko | 2017-08-22 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9741701 | Method of manufacturing a package-on-package type semiconductor package | Dong Jin Kim, Jin Han Kim, Se Woong Cha, Ji Hun Lee, Yeong Beom Ko | 2017-08-22 |