Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9850390 | Epoxy resin composition for encapsulating semiconductor device and semiconductor device prepared using the same | Ki Hyeok KWON, Min Gyum KIM, Joo Young Chung, Jin Woo CHOI, Seung Hun Han | 2017-12-26 |