Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9716192 | Method for fabricating a photovoltaic device by uniform plating on emitter-lined through-wafer vias and interconnects | Brett C. Baker-O'Neal, Shu-Yun Chong, John M. Cotte, Ronald D. Goldblatt, Qiang Huang +4 more | 2017-07-25 |