Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9716192 | Method for fabricating a photovoltaic device by uniform plating on emitter-lined through-wafer vias and interconnects | Shu-Yun Chong, John M. Cotte, Ronald D. Goldblatt, Jeffrey Hedrick, Qiang Huang +4 more | 2017-07-25 |
| 9564362 | Interconnects based on subtractive etching of silver | Eric A. Joseph, Hiroyuki Miyazoe | 2017-02-07 |