Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9673064 | Interposer with lattice construction and embedded conductive metal structures | Benjamin V. Fasano, Shidong Li | 2017-06-06 |
| 9553079 | Flip chip assembly with connected component | Luc Guerin, Richard Langlois, Stephan L. Martel, Sylvain E. Ouimet | 2017-01-24 |