Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9818736 | Method for producing semiconductor package | Makoto Orikasa, Yuhei Horikawa, Hisayuki Abe | 2017-11-14 |
| 9640500 | Terminal structure and semiconductor device | Kenichi Yoshida, Makoto Orikasa, Yuhei Horikawa, Hisayuki Abe | 2017-05-02 |