Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9818736 | Method for producing semiconductor package | Hideyuki Seike, Yuhei Horikawa, Hisayuki Abe | 2017-11-14 |
| 9640500 | Terminal structure and semiconductor device | Kenichi Yoshida, Hideyuki Seike, Yuhei Horikawa, Hisayuki Abe | 2017-05-02 |
| 9620156 | Magnetic head device | Katsuhiko Igarashi, Takashi Kawashima, Hisayuki Abe | 2017-04-11 |