Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9847445 | LED thin-film device partial singulation prior to substrate thinning or removal | — | 2017-12-19 |
| 9773941 | Separating a wafer of light emitting devices | Satyanarayana Rao Peddada | 2017-09-26 |
| 9722138 | Separating a wafer of light emitting devices | Rao S. Peddada | 2017-08-01 |
| 9576835 | Workpiece processing method | Hiroshi Morikazu, Nao Hattori | 2017-02-21 |