Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9836095 | Microelectronic device package electromagnetic shield | Min Suet Lim, Khang Choong Yong, Boon Ping Koh, Wil Choon Song | 2017-12-05 |
| 9613920 | Microelectronic package utilizing multiple bumpless build-up structures and through-silicon vias | Hoay Tien Teoh | 2017-04-04 |
| 9606949 | Universal scalable system: on-the-fly system performance conversion via PC-on-a-card and USB for smart devices and IoT enabling | Khang Choong Yong, Khai Ern See, Amit Kumar Srivastava, Jackson Chung Peng Kong, Teong Keat Beh | 2017-03-28 |