Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9613920 | Microelectronic package utilizing multiple bumpless build-up structures and through-silicon vias | Eng Huat Goh | 2017-04-04 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9613920 | Microelectronic package utilizing multiple bumpless build-up structures and through-silicon vias | Eng Huat Goh | 2017-04-04 |