Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 9613920 | Microelectronic package utilizing multiple bumpless build-up structures and through-silicon vias | Eng Huat Goh | 2017-04-04 | $8,141,000 |
HT
Hoay Tien Teoh — 1 Patent in 2017
Overall (2017): #398,434 of 506,227Top 80%
1
Patents 2017