Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9564400 | Methods of forming stacked microelectronic dice embedded in a microelectronic substrate | Reinhard Mahnkopf, Wolfgang Molzer, Bernd Memmler, Hans-Joachim Barth, Sven Albers +1 more | 2017-02-07 |