Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 9564400 | Methods of forming stacked microelectronic dice embedded in a microelectronic substrate | Reinhard Mahnkopf, Wolfgang Molzer, Edmund Goetz, Hans-Joachim Barth, Sven Albers +1 more | 2017-02-07 | $9,424,000 |