Issued Patents 2017
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9818721 | Semiconductor device and manufacturing method thereof | Jong Sik Paek | 2017-11-14 |
| 9818685 | Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layers | Jong Sik Paek, Jin Young Kim, YoonJoo Kim, Jin Han Kim, Seungjae Lee +4 more | 2017-11-14 |
| 9793180 | Semiconductor device and manufacturing method thereof | Seo Yeon Ahn, Pil Je Sung, Won Chul Do, Young Rae Kim, Seung Chul Han +2 more | 2017-10-17 |
| 9728514 | Semiconductor device and manufacturing method thereof | Jong Sik Paek, Won Chul Do, Eun Ho Park, Sung Jae Oh | 2017-08-08 |
| 9711484 | Semiconductor package with semiconductor die directly attached to lead frame and method | Jong Sik Paek, Wang Gu Lee, Yong Seon Song, Sung Geun Kang | 2017-07-18 |
| 9627368 | Semiconductor device using EMC wafer support system and fabricating method thereof | Jin Young Kim, Ju Hoon Yoon, Seong Min Seo, Glenn Rinne, Choon Heung Lee | 2017-04-18 |
| 9627353 | Method of manufacturing a semiconductor package | Michael Kelly, David Jon Hiner, Ji Hun Lee, Won Chul Do, Ronald Patrick Huemoeller | 2017-04-18 |
| 9536858 | Semiconductor device and manufacturing method thereof | Won Chul Do, Jong Sik Paek, Ji Hun Lee, Seong Min Seo | 2017-01-03 |