Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9818659 | Multi-die package comprising unit specific alignment and unit specific routing | — | 2017-11-14 |
| 9754835 | Semiconductor device and method comprising redistribution layers | Christopher M. Scanlan | 2017-09-05 |
| 9613830 | Fully molded peripheral package on package device | Christopher M. Scanlan, William Boyd Rogers | 2017-04-04 |
| 9576919 | Semiconductor device and method comprising redistribution layers | Christopher M. Scanlan | 2017-02-21 |